項目/Item
|
物性/Property
|
單位/Unit
|
ZKPI-8000
|
測試條件
|
|
應(yīng)用/Application
|
|
低溫半導體器件保護
|
180-200℃
|
液體性質(zhì)
Liquid Property |
固含量/Solid Content
|
wt.%
|
27±3 %
|
|
黏度/Viscosity
|
mPa•s/CP
|
1400-1600cp
|
E-type 25℃
|
|
離子含量/Impurity Content
|
ppm
|
<3
|
ICP-MS
|
|
色度(Gardner)/Coloring
|
|
<16
|
Gardner
|
|
膜性質(zhì)
Film Property |
拉伸強度/Ultimate tensile strength
|
MPa
|
> 350
|
|
拉伸模量/Tensile modulus
|
GPa
|
> 8.5
|
|
|
斷裂伸長率/Elongation at break
|
%
|
> 8
|
|
|
Tg
|
℃(DSC)
|
> 360
|
|
|
熱分解溫度/Thermal decomposition temperature
|
℃(TGA)
|
> 500
|
|
|
熱膨脹系數(shù)/Coefficient of thermal expansion
|
ppm/℃(TMA)
|
< 35
|
|
|
內(nèi)應(yīng)力/Internal stress
|
MPa
|
<34
|
|
|
介電常數(shù)/Dielectric constant
|
1 MHz
|
< 3.2
|
|
|
介電損耗/Dielectric loss
|
1 MHz
|
< 0.008
|
|
|
介電強度/Dielectric strength
|
V/mm
|
> 200
|
|
|
體積電阻率/Volume resistivity
|
W.cm2
|
> 1*1016
|
|
|
表面電阻率/Surface resistivity
|
W.cm
|
>1*1016
|
|
|
吸水率/Water absorption
|
%
|
< 0.6
|
|
|
產(chǎn)品特點
|
耐低溫、粘附性高
|